Patent Assignment Details
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| Reel/Frame: | 061992/0794 | |
| Pages: | 9 |
| | Recorded: | 11/23/2022 | | |
| Attorney Dkt #: | 28910US06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17989791
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Filing Dt:
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11/18/2022
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Publication #:
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Pub Dt:
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06/15/2023
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Title:
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Method of Manufacturing a Package-on-Package Type Semiconductor Package
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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06/07/2024 01:02 AM
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