Patent Assignment Details
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Reel/Frame: | 062764/0795 | |
| Pages: | 5 |
| | Recorded: | 02/22/2023 | | |
Attorney Dkt #: | 148047-0011US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18112590
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Filing Dt:
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02/22/2023
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Publication #:
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Pub Dt:
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04/25/2024
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Title:
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MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION PLATE AND PREPARATION METHOD THEREOF
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Assignee
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363 CHANGXING ROAD, TIANHE DISTRICT |
GUANGZHOU, GUANGDONG, CHINA 510650 |
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Correspondence name and address
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GUNTHER J. EVANINA
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2410 WOODLAKE DRIVE
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SUITE 420
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OKEMOS, MI 48864
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05/30/2024 06:30 AM
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