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Reel/Frame:	028230/0798			Pages:	122
		Recorded:	05/14/2012
Conveyance:	SECURITY AGREEMENT

Total properties: 175
Page 2 of 2
Pages: 1 2

1

Patent #:	8063315	Issue Dt:	11/22/2011	Application #:	11802434	Filing Dt:	05/23/2007
Publication #:	US20070221404	Pub Dt:	09/27/2007
Title:	CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE

2

Patent #:	7687724	Issue Dt:	03/30/2010	Application #:	11806685	Filing Dt:	06/04/2007
Publication #:	US20080087459	Pub Dt:	04/17/2008
Title:	CIRCUITIZED SUBSTRATE WITH INTERNAL RESISTOR, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND ELECTRICAL ASSEMBLY UTILIZING SAID CIRCUITIZED SUBSTRATE

3

Patent #:	7712210	Issue Dt:	05/11/2010	Application #:	11808140	Filing Dt:	06/07/2007
Publication #:	US20080301933	Pub Dt:	12/11/2008
Title:	METHOD OF PROVIDING A PRINTED CIRCUIT BOARD WITH AN EDGE CONNECTION PORTION

4

Patent #:	7326643	Issue Dt:	02/05/2008	Application #:	11808596	Filing Dt:	06/12/2007
Publication #:	US20070249089	Pub Dt:	10/25/2007
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL ORGANIC MEMORY DEVICE

5

Patent #:	7510912	Issue Dt:	03/31/2009	Application #:	11822573	Filing Dt:	07/09/2007
Publication #:	US20070254408	Pub Dt:	11/01/2007
Title:	METHOD OF MAKING WIREBOND ELECTRONIC PACKAGE WITH ENHANCED CHIP PAD DESIGN

6

Patent #:	NONE	Issue Dt:		Application #:	11878673	Filing Dt:	07/26/2007
Publication #:	US20080248596	Pub Dt:	10/09/2008
Title:	Method of making a circuitized substrate having at least one capacitor therein

7

Patent #:	NONE	Issue Dt:		Application #:	11882149	Filing Dt:	07/31/2007
Publication #:	US20090035455	Pub Dt:	02/05/2009
Title:	Adhesive bleed prevention method and product produced from same

8

Patent #:	7328502	Issue Dt:	02/12/2008	Application #:	11882625	Filing Dt:	08/03/2007
Publication #:	US20070266555	Pub Dt:	11/22/2007
Title:	APPARATUS FOR MAKING CIRCUITIZED SUBSTRATES IN A CONTINUOUS MANNER

9

Patent #:	7589283	Issue Dt:	09/15/2009	Application #:	11889668	Filing Dt:	08/15/2007
Publication #:	US20070284140	Pub Dt:	12/13/2007
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH IMPROVED IMPEDANCE CONTROL CIRCUITRY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM

10

Patent #:	8445094	Issue Dt:	05/21/2013	Application #:	11896786	Filing Dt:	09/06/2007
Publication #:	US20080003407	Pub Dt:	01/03/2008
Title:	Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

11

Patent #:	7511518	Issue Dt:	03/31/2009	Application #:	11902976	Filing Dt:	09/27/2007
Publication #:	US20080020566	Pub Dt:	01/24/2008
Title:	METHOD OF MAKING AN INTERPOSER

12

Patent #:	7823274	Issue Dt:	11/02/2010	Application #:	11905188	Filing Dt:	09/28/2007
Publication #:	US20080022520	Pub Dt:	01/31/2008
Title:	METHOD OF MAKING MULTILAYERED CIRCUITIZED SUBSTRATE ASSEMBLY

13

Patent #:	7713767	Issue Dt:	05/11/2010	Application #:	11907004	Filing Dt:	10/09/2007
Publication #:	US20090093073	Pub Dt:	04/09/2009
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY USING PHOTOLITHOGRAPHY

14

Patent #:	7541058	Issue Dt:	06/02/2009	Application #:	11907006	Filing Dt:	10/09/2007
Publication #:	US20090092353	Pub Dt:	04/09/2009
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY

15

Patent #:	7738249	Issue Dt:	06/15/2010	Application #:	11976468	Filing Dt:	10/25/2007
Publication #:	US20090109624	Pub Dt:	04/30/2009
Title:	CIRCUITIZED SUBSTRATE WITH INTERNAL COOLING STRUCTURE AND ELECTRICAL ASSEMBLY UTILIZING SAME

16

Patent #:	NONE	Issue Dt:		Application #:	11976629	Filing Dt:	10/26/2007
Publication #:	US20080054476	Pub Dt:	03/06/2008
Title:	Circuitized substrate with increased roughness conductive layer as part thereof

17

Patent #:	7622384	Issue Dt:	11/24/2009	Application #:	12003299	Filing Dt:	12/21/2007
Publication #:	US20080102562	Pub Dt:	05/01/2008
Title:	METHOD OF MAKING MULTI-CHIP ELECTRONIC PACKAGE WITH REDUCED LINE SKEW

18

Patent #:	NONE	Issue Dt:		Application #:	12007178	Filing Dt:	01/08/2008
Publication #:	US20080105457	Pub Dt:	05/08/2008
Title:	Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof

19

Patent #:	NONE	Issue Dt:		Application #:	12007704	Filing Dt:	01/15/2008
Publication #:	US20090178273	Pub Dt:	07/16/2009
Title:	Method of making circuitized assembly including a plurality of circuitized substrates

20

Patent #:	8240027	Issue Dt:	08/14/2012	Application #:	12007820	Filing Dt:	01/16/2008
Publication #:	US20090178271	Pub Dt:	07/16/2009
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATES HAVING FILM RESISTORS AS PART THEREOF

21

Patent #:	7491896	Issue Dt:	02/17/2009	Application #:	12010004	Filing Dt:	01/18/2008
Publication #:	US20080117583	Pub Dt:	05/22/2008
Title:	INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER

22

Patent #:	7875811	Issue Dt:	01/25/2011	Application #:	12010335	Filing Dt:	01/24/2008
Publication #:	US20080142258	Pub Dt:	06/19/2008
Title:	HIGH SPEED INTERPOSER

23

Patent #:	NONE	Issue Dt:		Application #:	12010469	Filing Dt:	01/25/2008
Publication #:	US20080120835	Pub Dt:	05/29/2008
Title:	Method of making high speed interposer

24

Patent #:	NONE	Issue Dt:		Application #:	12078206	Filing Dt:	03/28/2008
Publication #:	US20090241332	Pub Dt:	10/01/2009
Title:	Circuitized, multilayer substrate

25

Patent #:	7646098	Issue Dt:	01/12/2010	Application #:	12081042	Filing Dt:	04/10/2008
Publication #:	US20080191353	Pub Dt:	08/14/2008
Title:	MULTILAYERED CIRCUITIZED SUBSTRATE WITH P-ARAMID DIELECTRIC LAYERS AND METHOD OF MAKING SAME

26

Patent #:	8084863	Issue Dt:	12/27/2011	Application #:	12081051	Filing Dt:	04/10/2008
Publication #:	US20080191354	Pub Dt:	08/14/2008
Title:	CIRCUITIZED SUBSTRATE WITH CONTINUOUS THERMOPLASTIC SUPPORT FILM DIELECTRIC LAYERS

27

Patent #:	7838776	Issue Dt:	11/23/2010	Application #:	12148271	Filing Dt:	04/17/2008
Publication #:	US20080259581	Pub Dt:	10/23/2008
Title:	CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF

28

Patent #:	8028390	Issue Dt:	10/04/2011	Application #:	12215079	Filing Dt:	06/25/2008
Publication #:	US20090320280	Pub Dt:	12/31/2009
Title:	SPRING ACTUATED CLAMPING MECHANISM

29

Patent #:	7791897	Issue Dt:	09/07/2010	Application #:	12283146	Filing Dt:	09/09/2008
Publication #:	US20100060381	Pub Dt:	03/11/2010
Title:	MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE

30

Patent #:	7803688	Issue Dt:	09/28/2010	Application #:	12380616	Filing Dt:	03/02/2009
Publication #:	US20090206051	Pub Dt:	08/20/2009
Title:	CAPACITIVE SUBSTRATE AND METHOD OF MAKING SAME

31

Patent #:	8211790	Issue Dt:	07/03/2012	Application #:	12380617	Filing Dt:	03/02/2009
Publication #:	US20090173426	Pub Dt:	07/09/2009
Title:	MULTILAYERED CIRCUITIZED SUBSTRATE WITH P-ARAMID DIELECTRIC LAYERS AND METHOD OF MAKING SAME

32

Patent #:	8499440	Issue Dt:	08/06/2013	Application #:	12380618	Filing Dt:	03/02/2009
Publication #:	US20090175000	Pub Dt:	07/09/2009
Title:	METHOD OF MAKING HALOGEN-FREE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION

33

Patent #:	NONE	Issue Dt:		Application #:	12380637	Filing Dt:	03/02/2009
Publication #:	US20090258161	Pub Dt:	10/15/2009
Title:	Method of making a circuitized substrate with continuous thermoplastic support film dielectric layers

34

Patent #:	NONE	Issue Dt:		Application #:	12460975	Filing Dt:	07/27/2009
Publication #:	US20110017498	Pub Dt:	01/27/2011
Title:	Photosensitive dielectric film

35

Patent #:	9420689	Issue Dt:	08/16/2016	Application #:	12589239	Filing Dt:	10/20/2009
Publication #:	US20110039212	Pub Dt:	02/17/2011
Title:	Method of making a circuitized substrate

36

Patent #:	8405229	Issue Dt:	03/26/2013	Application #:	12592682	Filing Dt:	11/30/2009
Publication #:	US20110127664	Pub Dt:	06/02/2011
Title:	ELECTRONIC PACKAGE INCLUDING HIGH DENSITY INTERPOSER AND CIRCUITIZED SUBSTRATE ASSEMBLY UTILIZING SAME

37

Patent #:	8245392	Issue Dt:	08/21/2012	Application #:	12592734	Filing Dt:	12/01/2009
Publication #:	US20110126408	Pub Dt:	06/02/2011
Title:	METHOD OF MAKING HIGH DENSITY INTERPOSER AND ELECTRONIC PACKAGE UTILIZING SAME

38

Patent #:	NONE	Issue Dt:		Application #:	12653680	Filing Dt:	12/16/2009
Publication #:	US20110139364	Pub Dt:	06/16/2011
Title:	Chemical modification of chromate conversion coated aluminum work pieces

39

Patent #:	7977034	Issue Dt:	07/12/2011	Application #:	12657394	Filing Dt:	01/20/2010
Publication #:	US20110173809	Pub Dt:	07/21/2011
Title:	METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIELECTRIC LAYERS IN A CONTINUOUS MANNER

40

Patent #:	7898877	Issue Dt:	03/01/2011	Application #:	12659521	Filing Dt:	03/11/2010
Publication #:	US20100182849	Pub Dt:	07/22/2010
Title:	SYNCHRONOUS SEMICONDUCTOR DEVICE AND DATA PROCESSING SYSTEM INCLUDING THE SAME

41

Patent #:	NONE	Issue Dt:		Application #:	12712238	Filing Dt:	02/25/2010
Publication #:	US20110207866	Pub Dt:	08/25/2011
Title:	Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates

42

Patent #:	8144480	Issue Dt:	03/27/2012	Application #:	12720849	Filing Dt:	03/10/2010
Publication #:	US20100167210	Pub Dt:	07/01/2010
Title:	MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE

43

Patent #:	8541687	Issue Dt:	09/24/2013	Application #:	12764993	Filing Dt:	04/22/2010
Publication #:	US20120160547	Pub Dt:	06/28/2012
Title:	CORELESS LAYER BUILDUP STRUCTURE

44

Patent #:	8536459	Issue Dt:	09/17/2013	Application #:	12764994	Filing Dt:	04/22/2010
Publication #:	US20120160544	Pub Dt:	06/28/2012
Title:	CORELESS LAYER BUILDUP STRUCTURE WITH LGA

45

Patent #:	9351408	Issue Dt:	05/24/2016	Application #:	12764997	Filing Dt:	04/22/2010
Publication #:	US20120031649	Pub Dt:	02/09/2012
Title:	CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER

46

Patent #:	NONE	Issue Dt:		Application #:	12765110	Filing Dt:	04/22/2010
Publication #:	US20110260299	Pub Dt:	10/27/2011
Title:	METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS

47

Patent #:	8198551	Issue Dt:	06/12/2012	Application #:	12782187	Filing Dt:	05/18/2010
Publication #:	US20110284273	Pub Dt:	11/24/2011
Title:	POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

48

Patent #:	7972178	Issue Dt:	07/05/2011	Application #:	12789642	Filing Dt:	05/28/2010
Publication #:	US20100323558	Pub Dt:	12/23/2010
Title:	HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKAGING STRUCTURES

49

Patent #:	8198739	Issue Dt:	06/12/2012	Application #:	12836612	Filing Dt:	08/13/2010
Publication #:	US20120038046	Pub Dt:	02/16/2012
Title:	SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME

50

Patent #:	NONE	Issue Dt:		Application #:	12837584	Filing Dt:	07/16/2010
Publication #:	US20120012553	Pub Dt:	01/19/2012
Title:	METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

51

Patent #:	8240031	Issue Dt:	08/14/2012	Application #:	12837640	Filing Dt:	07/16/2010
Publication #:	US20120015532	Pub Dt:	01/19/2012
Title:	A METHOD OF JOINING A SEMICONDUCTOR DEVICE/CHIP TO A PRINTED WIRING BOARD

52

Patent #:	8242376	Issue Dt:	08/14/2012	Application #:	12854252	Filing Dt:	08/11/2010
Publication #:	US20100328868	Pub Dt:	12/30/2010
Title:	CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF

53

Patent #:	8143530	Issue Dt:	03/27/2012	Application #:	12884392	Filing Dt:	09/17/2010
Publication #:	US20120069288	Pub Dt:	03/22/2012
Title:	LIQUID CRYSTAL POLYMER LAYER FOR ENCAPSULATION AND IMPROVED HERMITICITY OF CIRCUITIZED SUBSTRATES

54

Patent #:	8288857	Issue Dt:	10/16/2012	Application #:	12884421	Filing Dt:	09/17/2010
Publication #:	US20120068326	Pub Dt:	03/22/2012
Title:	ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS

55

Patent #:	8685284	Issue Dt:	04/01/2014	Application #:	12884657	Filing Dt:	09/17/2010
Publication #:	US20120069531	Pub Dt:	03/22/2012
Title:	CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS

56

Patent #:	NONE	Issue Dt:		Application #:	12904305	Filing Dt:	10/14/2010
Publication #:	US20120243147	Pub Dt:	09/27/2012
Title:	LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION

57

Patent #:	8501575	Issue Dt:	08/06/2013	Application #:	12909983	Filing Dt:	10/22/2010
Publication #:	US20120223047	Pub Dt:	09/06/2012
Title:	METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE

58

Patent #:	NONE	Issue Dt:		Application #:	12910020	Filing Dt:	10/22/2010
Publication #:	US20120162928	Pub Dt:	06/28/2012
Title:	ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

59

Patent #:	8247703	Issue Dt:	08/21/2012	Application #:	12938759	Filing Dt:	11/03/2010
Publication #:	US20110043987	Pub Dt:	02/24/2011
Title:	METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATERIAL WITH METAL COMPONENT AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE

60

Patent #:	NONE	Issue Dt:		Application #:	12939659	Filing Dt:	11/04/2010
Publication #:	US20120112345	Pub Dt:	05/10/2012
Title:	HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE

61

Patent #:	8299371	Issue Dt:	10/30/2012	Application #:	12972700	Filing Dt:	12/20/2010
Publication #:	US20120152605	Pub Dt:	06/21/2012
Title:	CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD

62

Patent #:	NONE	Issue Dt:		Application #:	13009922	Filing Dt:	01/20/2011
Publication #:	US20120243155	Pub Dt:	09/27/2012
Title:	CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME

63

Patent #:	8558374	Issue Dt:	10/15/2013	Application #:	13022654	Filing Dt:	02/08/2011
Publication #:	US20120201006	Pub Dt:	08/09/2012
Title:	ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME

64

Patent #:	NONE	Issue Dt:		Application #:	13041655	Filing Dt:	03/07/2011
Publication #:	US20120228013	Pub Dt:	09/13/2012
Title:	DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS

65

Patent #:	NONE	Issue Dt:		Application #:	13082502	Filing Dt:	04/08/2011
Publication #:	US20120257343	Pub Dt:	10/11/2012
Title:	CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION

66

Patent #:	NONE	Issue Dt:		Application #:	13082599	Filing Dt:	04/08/2011
Publication #:	US20120260063	Pub Dt:	10/11/2012
Title:	MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM

67

Patent #:	8196281	Issue Dt:	06/12/2012	Application #:	13090676	Filing Dt:	04/20/2011
Publication #:	US20110197430	Pub Dt:	08/18/2011
Title:	METHOD OF APPLYING FORCE TO ELECTRICAL CONTACTS ON A PRINTED CIRCUIT BOARD

68

Patent #:	8499445	Issue Dt:	08/06/2013	Application #:	13184699	Filing Dt:	07/18/2011
Title:	A METHOD OF FORMING AN ELECTRICALLY CONDUCTIVE PRINTED LINE

69

Patent #:	NONE	Issue Dt:		Application #:	13189980	Filing Dt:	07/25/2011
Publication #:	US20130025839	Pub Dt:	01/31/2013
Title:	THERMAL SUBSTRATE

70

Patent #:	NONE	Issue Dt:		Application #:	13197804	Filing Dt:	08/04/2011
Publication #:	US20130033671	Pub Dt:	02/07/2013
Title:	LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT

71

Patent #:	9451693	Issue Dt:	09/20/2016	Application #:	13198756	Filing Dt:	08/05/2011
Publication #:	US20130033827	Pub Dt:	02/07/2013
Title:	ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS

72

Patent #:	9756724	Issue Dt:	09/05/2017	Application #:	13252256	Filing Dt:	10/04/2011
Publication #:	US20120017437	Pub Dt:	01/26/2012
Title:	METHOD OF MAKING A CIRCUITIZED SUBSTRATE

73

Patent #:	8446707	Issue Dt:	05/21/2013	Application #:	13269770	Filing Dt:	10/10/2011
Title:	CIRCUITIZED SUBSTRATE WITH LOW LOSS CAPACITIVE MATERIAL AND METHOD OF MAKING SAME

74

Patent #:	8592299	Issue Dt:	11/26/2013	Application #:	13358716	Filing Dt:	01/26/2012
Title:	SOLDER AND ELECTRICALLY CONDUCTIVE ADHESIVE BASED INTERCONNECTION FOR CZT CRYSTAL ATTACH

75

Patent #:	2454289	Issue Dt:		Application #:	UNAVAILABLE	Filing Dt:
Title:

Assignors

1

ENDICOTT INTERCONNECT TECHNOLOGIES, INC.

Exec Dt:

02/10/2012

2

EI TRANSPORTATION COMPANY LLC

Exec Dt:

02/10/2012

3

ENDICOTT MEDTECH, INC.

Exec Dt:

02/10/2012

Assignee

1

PNC BANK, NATIONAL ASSOCIATION

500 FIRST AVENUE

COMMERCIAL LOAN SERVICE CENTER/DCC

PITTSBURGH, PENNSYLVANIA 15219

Correspondence name and address
	OLIVIA H. TARBOX, PARALEGAL
	BLANK ROME LLP
	ONE LOGAN SQUARE - 8TH FLOOR
	PHILADELPHIA, PA 19103-6998

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