Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 019192/0798 | |
| Pages: | 5 |
| | Recorded: | 04/23/2007 | | |
Attorney Dkt #: | 070066 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE; THE FILING DATE; AND THE TITLE PREVIOUSLY RECORDED ON REEL 019018 FRAME 0014. ASSIGNOR(S) HEREBY CONFIRMS THE EXECUTION DATE: 02/19/2007; FILING DATE :02/22/2007; AND TITLE: SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME.. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11709137
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Filing Dt:
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02/22/2007
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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Stacked semiconductor module with two wirings
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Assignee
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80, OSHIMADA-MACHI, |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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ARMSTRONG,KRATZ,QUINTOS,HANSON,BROOKSLLP
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SUITE 1000, 1725 K. STREET, N.W.,
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WASHINGTON,, DC 20006
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