Total properties:
32
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10717032
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Filing Dt:
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11/18/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
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Patent #:
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Issue Dt:
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06/26/2007
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Application #:
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10754360
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Filing Dt:
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01/08/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Title:
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DEVICES AND METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10785393
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Filing Dt:
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02/23/2004
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Publication #:
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Pub Dt:
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11/18/2004
| | | | |
Title:
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ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
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Patent #:
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Issue Dt:
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01/17/2006
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Application #:
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10850346
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Filing Dt:
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05/20/2004
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Publication #:
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Pub Dt:
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01/13/2005
| | | | |
Title:
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POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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10860381
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Filing Dt:
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06/01/2004
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Publication #:
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Pub Dt:
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01/13/2005
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Title:
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CHUCK FOR SUPPORTING WAFERS WITH A FLUID
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Patent #:
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Issue Dt:
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05/09/2006
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Application #:
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11046502
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Filing Dt:
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01/28/2005
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Title:
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CHEMICAL-MECHANICAL PLANARIZATION TOOL FORCE CALIBRATION METHOD AND SYSTEM
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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11055550
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Filing Dt:
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02/10/2005
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Publication #:
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Pub Dt:
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09/29/2005
| | | | |
Title:
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WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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11072636
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Filing Dt:
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03/04/2005
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Publication #:
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Pub Dt:
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09/15/2005
| | | | |
Title:
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INDEPENDENT EDGE CONTROL FOR CMP CARRIERS
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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11084475
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Filing Dt:
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03/18/2005
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Publication #:
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Pub Dt:
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07/28/2005
| | | | |
Title:
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RETAINING RING FOR WAFER CARRIERS
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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11173992
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Filing Dt:
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07/01/2005
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Publication #:
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Pub Dt:
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02/16/2006
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Title:
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METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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11334148
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Filing Dt:
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01/17/2006
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Publication #:
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Pub Dt:
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06/01/2006
| | | | |
Title:
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POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
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Patent #:
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Issue Dt:
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12/23/2008
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Application #:
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11369700
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Filing Dt:
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03/06/2006
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Publication #:
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Pub Dt:
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07/27/2006
| | | | |
Title:
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BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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11410440
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Filing Dt:
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04/24/2006
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Publication #:
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Pub Dt:
|
08/31/2006
| | | | |
Title:
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WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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11443788
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Filing Dt:
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05/30/2006
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Publication #:
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Pub Dt:
|
09/28/2006
| | | | |
Title:
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ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
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|
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Patent #:
|
|
Issue Dt:
|
12/02/2008
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Application #:
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11548213
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Filing Dt:
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10/10/2006
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Publication #:
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Pub Dt:
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06/07/2007
| | | | |
Title:
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GRINDING APPARATUS AND METHOD
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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11594267
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Filing Dt:
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11/07/2006
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Publication #:
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Pub Dt:
|
03/08/2007
| | | | |
Title:
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WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
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|
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Patent #:
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|
Issue Dt:
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06/23/2009
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Application #:
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11600978
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Filing Dt:
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11/17/2006
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Publication #:
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Pub Dt:
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06/28/2007
| | | | |
Title:
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ROBOT CALIBRATION SYSTEM AND METHOD
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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11768873
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
|
02/07/2008
| | | | |
Title:
|
METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
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|
|
Patent #:
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|
Issue Dt:
|
11/08/2011
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Application #:
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11829798
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Filing Dt:
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07/27/2007
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Publication #:
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Pub Dt:
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11/22/2007
| | | | |
Title:
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METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
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|
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Patent #:
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|
Issue Dt:
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06/14/2011
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Application #:
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11969175
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Filing Dt:
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01/03/2008
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Publication #:
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Pub Dt:
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07/09/2009
| | | | |
Title:
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FLEXIBLE MEMBRANE ASSEMBLY FOR A CMP SYSTEM AND METHOD OF USING
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|
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Patent #:
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|
Issue Dt:
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05/22/2012
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Application #:
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12205861
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Filing Dt:
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09/06/2008
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Publication #:
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Pub Dt:
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03/11/2010
| | | | |
Title:
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CMP SYSTEM WITH WIRELESS ENDPOINT DETECTION SYSTEM
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|
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Patent #:
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|
Issue Dt:
|
03/13/2012
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Application #:
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12287550
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Filing Dt:
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10/10/2008
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Publication #:
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Pub Dt:
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04/15/2010
| | | | |
Title:
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GRINDING APPARATUS HAVING AN EXTENDABLE WHEEL MOUNT
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Patent #:
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Issue Dt:
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04/05/2011
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Application #:
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12705091
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Filing Dt:
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02/12/2010
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Publication #:
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Pub Dt:
|
06/10/2010
| | | | |
Title:
|
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
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|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
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Application #:
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13252897
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Filing Dt:
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10/04/2011
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Publication #:
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Pub Dt:
|
04/12/2012
| | | | |
Title:
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CMP RETAINING RING WITH SOFT RETAINING RING INSERT
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|
|
Patent #:
|
|
Issue Dt:
|
10/22/2013
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Application #:
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13290900
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Filing Dt:
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11/07/2011
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Publication #:
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Pub Dt:
|
02/23/2012
| | | | |
Title:
|
METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
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|
|
Patent #:
|
|
Issue Dt:
|
08/27/2013
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Application #:
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13291800
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Filing Dt:
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11/08/2011
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Publication #:
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|
Pub Dt:
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05/09/2013
| | | | |
Title:
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SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS
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|
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Patent #:
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|
Issue Dt:
|
03/03/2015
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Application #:
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13656514
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Filing Dt:
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10/19/2012
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Publication #:
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Pub Dt:
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04/25/2013
| | | | |
Title:
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SYSTEMS AND METHODS OF WAFER GRINDING
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|
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Patent #:
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|
Issue Dt:
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12/23/2014
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Application #:
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13694723
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Filing Dt:
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12/27/2012
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Publication #:
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Pub Dt:
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07/03/2014
| | | | |
Title:
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Method and apparatus for cleaning grinding work chuck using a vacuum
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|
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Patent #:
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|
Issue Dt:
|
07/19/2016
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Application #:
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13740101
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Filing Dt:
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01/11/2013
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Publication #:
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Pub Dt:
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05/23/2013
| | | | |
Title:
|
SYSTEMS AND METHODS OF PROCESSING SUBSTRATES
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|
|
Patent #:
|
|
Issue Dt:
|
10/04/2016
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Application #:
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14042591
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Filing Dt:
|
09/30/2013
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Publication #:
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|
Pub Dt:
|
05/15/2014
| | | | |
Title:
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METHODS AND SYSTEMS FOR USE IN GRIND SHAPE CONTROL ADAPTATION
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|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
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14042600
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Filing Dt:
|
09/30/2013
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
Title:
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METHODS AND SYSTEMS FOR USE IN GRIND SPINDLE ALIGNMENT
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|
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Patent #:
|
|
Issue Dt:
|
07/14/2015
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Application #:
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14525115
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Filing Dt:
|
10/27/2014
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Publication #:
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Pub Dt:
|
04/30/2015
| | | | |
Title:
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METHOD OF GRINDING WAFER STACKS TO PROVIDE UNIFORM RESIDUAL SILICON THICKNESS
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|