Total properties:
37
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Patent #:
|
|
Issue Dt:
|
09/30/1997
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Application #:
|
08438261
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Filing Dt:
|
05/10/1995
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Title:
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INTEGRATED SEMICONDUCTOR WAFER PROCESSING SYSTEM
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|
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Patent #:
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|
Issue Dt:
|
11/16/1999
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Application #:
|
08450369
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Filing Dt:
|
05/25/1995
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Title:
|
PLASMA ETCH SYSTEM
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|
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Patent #:
|
|
Issue Dt:
|
08/12/2003
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Application #:
|
08564659
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Filing Dt:
|
11/29/1995
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Title:
|
APPARATUS FOR, AND METHOD OF, DEPOSITING A FILM ON A SUBSTRATE
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Patent #:
|
|
Issue Dt:
|
06/22/1999
|
Application #:
|
08651377
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Filing Dt:
|
05/22/1996
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Title:
|
APPARATUS FOR, AND METHOD OF, REMOVING HYDROCARBONS FROM THE SURFACE OF A SUBSTRATE
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|
|
Patent #:
|
|
Issue Dt:
|
04/11/2000
|
Application #:
|
08675093
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Filing Dt:
|
07/03/1996
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Title:
|
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
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|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
08675559
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Filing Dt:
|
07/03/1996
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Title:
|
PLASMA ETCH REACTOR AND METHOD
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|
|
Patent #:
|
|
Issue Dt:
|
07/11/2000
|
Application #:
|
08729015
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Filing Dt:
|
10/10/1996
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Title:
|
METHOD OF DEPOSITING MATERIALS ON A WAFER TO ELIMINATE THE EFFECT OF CRACKS IN THE DEPOSITION
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|
|
Patent #:
|
|
Issue Dt:
|
10/03/2000
|
Application #:
|
08742861
|
Filing Dt:
|
11/01/1996
|
Title:
|
METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER WITH FEATURES HAVING VERTICAL SIDEWALLS
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|
|
Patent #:
|
|
Issue Dt:
|
09/28/1999
|
Application #:
|
08850224
|
Filing Dt:
|
05/02/1997
|
Title:
|
PLASMA ETCH SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2000
|
Application #:
|
08974089
|
Filing Dt:
|
11/19/1997
|
Title:
|
A METHOD FOR MINIMIZING THE CRITICAL DIMENSION GROWTH OF A FEATURE ON A SEMICONDUCTOR WAFER
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|
|
Patent #:
|
|
Issue Dt:
|
02/12/2002
|
Application #:
|
09135210
|
Filing Dt:
|
08/17/1998
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Title:
|
METHOD AND APPARATUS FOR MINIMIZING SEMICONDUCTOR WAFER ARCING DURING SEMICONDUCTOR WAFER PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2002
|
Application #:
|
09152238
|
Filing Dt:
|
09/11/1998
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Title:
|
PLASMA ETCH REACTOR HAVING A PLURALITY OF MAGNETS (AS AMENDED)
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|
|
Patent #:
|
|
Issue Dt:
|
02/20/2001
|
Application #:
|
09384614
|
Filing Dt:
|
08/27/1999
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Title:
|
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
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|
|
Patent #:
|
|
Issue Dt:
|
06/25/2002
|
Application #:
|
09384858
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Filing Dt:
|
08/27/1999
|
Title:
|
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2000
|
Application #:
|
09412873
|
Filing Dt:
|
10/05/1999
|
Title:
|
PLASMA ETCH SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09454814
|
Filing Dt:
|
12/03/1999
|
Title:
|
COBALT SILICIDE ETCH PROCESS AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2003
|
Application #:
|
09455641
|
Filing Dt:
|
12/07/1999
|
Title:
|
PLASMA ETCH REACTOR AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2002
|
Application #:
|
09517387
|
Filing Dt:
|
03/02/2000
|
Title:
|
METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER WITH FEATURES HAVING VERTICAL SIDEWALLS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2001
|
Application #:
|
09609733
|
Filing Dt:
|
07/03/2000
|
Title:
|
Dual degas/cool loadlock cluster tool
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09712707
|
Filing Dt:
|
11/14/2000
|
Title:
|
METHOD AND APPARATUS FOR MINIMIZING SEMICONDUCTOR WAFER ARCING DURING SEMICONDUCTOR WAFER PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/2003
|
Application #:
|
09798048
|
Filing Dt:
|
03/05/2001
|
Publication #:
|
|
Pub Dt:
|
01/03/2002
| | | | |
Title:
|
DUAL DEGAS/COOL LOADLOCK CLUSTER TOOL
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2008
|
Application #:
|
09829587
|
Filing Dt:
|
04/09/2001
|
Publication #:
|
|
Pub Dt:
|
01/23/2003
| | | | |
Title:
|
SYSTEM FOR, AND METHOD OF, ETCHING A SURFACE ON A WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
09880584
|
Filing Dt:
|
06/13/2001
|
Publication #:
|
|
Pub Dt:
|
10/18/2001
| | | | |
Title:
|
METHOD FOR MINIMIZING THE CRITICAL DIMENSION GROWTH OF A FEATURE ON A SEMICONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2008
|
Application #:
|
09888365
|
Filing Dt:
|
06/22/2001
|
Publication #:
|
|
Pub Dt:
|
03/28/2002
| | | | |
Title:
|
REACTOR WITH HEATED AND TEXTURED ELECTRODES AND SURFACES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2004
|
Application #:
|
09949181
|
Filing Dt:
|
09/07/2001
|
Publication #:
|
|
Pub Dt:
|
03/13/2003
| | | | |
Title:
|
FLAT MAGNETRON
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2007
|
Application #:
|
10051886
|
Filing Dt:
|
01/16/2002
|
Publication #:
|
|
Pub Dt:
|
07/17/2003
| | | | |
Title:
|
PERMANENT ADHERENCE OF THE BACK END OF A WAFER TO AN ELECTRICAL COMPONENT OR SUB-ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10156478
|
Filing Dt:
|
05/28/2002
|
Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Title:
|
PLASMA ETCH REACTOR AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
12/14/2004
|
Application #:
|
10212293
|
Filing Dt:
|
08/05/2002
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
CLUSTER TOOL WITH A HOLLOW CATHODE ARRAY
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10371463
|
Filing Dt:
|
02/21/2003
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
Title:
|
MAGNETRON WITH CONTROLLED DC POWER
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10371862
|
Filing Dt:
|
02/21/2003
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
Title:
|
Magnetron with adjustable target positioning
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2007
|
Application #:
|
10446005
|
Filing Dt:
|
05/23/2003
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
Title:
|
REACTIVE SPUTTERING OF SILICON NITRIDE FILMS BY RF SUPPORTED DC MAGNETRON
|
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2007
|
Application #:
|
10633839
|
Filing Dt:
|
08/04/2003
|
Publication #:
|
|
Pub Dt:
|
02/26/2004
| | | | |
Title:
|
SYSTEM FOR, AND METHOD OF, ETCHING A SURFACE ON A WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2007
|
Application #:
|
10937660
|
Filing Dt:
|
09/09/2004
|
Publication #:
|
|
Pub Dt:
|
03/09/2006
| | | | |
Title:
|
SYSTEM AND METHOD FOR PROCESSING A WAFER INCLUDING STOP-ON-ALUMINA PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2007
|
Application #:
|
11087540
|
Filing Dt:
|
03/23/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
PLASMA ETCH REACTOR AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2010
|
Application #:
|
11724556
|
Filing Dt:
|
03/14/2007
|
Publication #:
|
|
Pub Dt:
|
07/05/2007
| | | | |
Title:
|
DRY ETCH STOP PROCESS FOR ELIMINATING ELECTRICAL SHORTING IN MRAM DEVICE STRUCTURES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12203022
|
Filing Dt:
|
09/02/2008
|
Publication #:
|
|
Pub Dt:
|
12/25/2008
| | | | |
Title:
|
REACTOR WITH HEATED AND TEXTURED ELECTRODES AND SURFACES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2011
|
Application #:
|
12552664
|
Filing Dt:
|
09/02/2009
|
Publication #:
|
|
Pub Dt:
|
01/28/2010
| | | | |
Title:
|
DRY ETCH STOP PROCESS FOR ELIMINATING ELECTRICAL SHORTING IN MRAM DEVICE STRUCTURES
|
|