Patent Assignment Details
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| Reel/Frame: | 056394/0799 | |
| Pages: | 11 |
| | Recorded: | 05/31/2021 | | |
| Attorney Dkt #: | YOR920110317US05/700US05 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17334937
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Filing Dt:
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05/31/2021
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Publication #:
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Pub Dt:
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09/16/2021
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Title:
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Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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OTTERSTEDT, WALLACE & KAMMER, LLP
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P.O. BOX 381
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COS COB, CT 06807-0381
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