Patent Assignment Details
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| Reel/Frame: | 050709/0800 | |
| Pages: | 5 |
| | Recorded: | 10/15/2019 | | |
| Attorney Dkt #: | WFDP0017USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16601607
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Filing Dt:
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10/15/2019
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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Power Flat No-lead Package
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Assignee
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| 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, KUEI SHAN DIST. |
| TAO YUAN CITY, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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05/29/2024 12:04 PM
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