Patent Assignment Details
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Reel/Frame: | 063884/0800 | |
| Pages: | 2 |
| | Recorded: | 06/07/2023 | | |
Attorney Dkt #: | 22562-5856 / 2020-139 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/2023
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Application #:
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17164268
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Filing Dt:
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02/01/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Title:
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HIGH-DENSITY INTEGRATED POWER ELECTRONIC ASSEMBLY INCLUDING DOUBLE-SIDED COOLING STRUCTURE
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Assignee
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1, TOYOTA-CHO |
TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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Correspondence name and address
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DINSMORE & SHOHL LLP
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255 EAST FIFTH STREET
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SUITE 1900
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CINCINNATI, OH 45202
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