Patent Assignment Details
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Reel/Frame: | 004588/0803 | |
| Pages: | 1 |
| | Recorded: | 05/21/1986 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/1987
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Application #:
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06865390
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Filing Dt:
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05/21/1986
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Title:
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EPOXY RESIN-BASED COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICES
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Assignee
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6-1, OTEMACHI 2-CHOME, CHIYODA-KU, |
TOKYO, JAPAN |
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Correspondence name and address
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HOPGOOD, CALIMAFDE, KALIL, BLAUSTEIN &
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JUDLOWE
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60 EAST 42ND ST.
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NEW YORK, NY 10165
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