Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 055778/0803 | |
| Pages: | 3 |
| | Recorded: | 03/31/2021 | | |
| Attorney Dkt #: | 251367-3670 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17218328
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Filing Dt:
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03/31/2021
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Publication #:
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Pub Dt:
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10/14/2021
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Title:
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SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE HAVING MULTI-DIES THEREOF
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Assignee
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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280 INTERSTATE NORTH CIRCLE SE
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SUITE 550
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ATLANTA, GA 30339
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