Patent Assignment Details
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Reel/Frame: | 012220/0804 | |
| Pages: | 4 |
| | Recorded: | 08/16/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/2004
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Application #:
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09913790
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Filing Dt:
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08/16/2001
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Publication #:
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Pub Dt:
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10/31/2002
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Title:
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WAFER POLISHING METHOD AND WAFER POLISHING DEVICE
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Assignee
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4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO 100-0005, JAPAN |
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Correspondence name and address
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OLIFF & BERRIDGE, PLC
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WILLIAM P. BERRIDGE
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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