Patent Assignment Details
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Reel/Frame: | 020187/0805 | |
| Pages: | 2 |
| | Recorded: | 12/03/2007 | | |
Attorney Dkt #: | 125155.00078 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/11/2018
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Application #:
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11949282
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Filing Dt:
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12/03/2007
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Publication #:
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Pub Dt:
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06/04/2009
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Title:
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Wafer Level Package Integration and Method
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ROBERT D. ATKINS
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QUARLES & BRADY LLP
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TWO NORTH CENTRAL AVENUE
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PHOENIX, AZ 85004-2391
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