Patent Assignment Details
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| Reel/Frame: | 013526/0806 | |
| Pages: | 2 |
| | Recorded: | 11/22/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10232682
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Filing Dt:
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09/03/2002
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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DOUBLE-SIDED THERMALLY ENHANCED IC CHIP PACKAGE
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Assignee
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| NO. 2, LI-HSIN RD.3 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN CHU, TAIWAN R.O.C. |
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Correspondence name and address
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BROWDY AND NEIMARK, PLLC
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NORMAN J. LATKER
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624 NINTH STREET NW, SUITE 300
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WASHINGTON, DC 20001-5303
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