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Reel/Frame:027260/0806   Pages: 3
Recorded: 11/21/2011
Attorney Dkt #:N1085-00799
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13237387
Filing Dt:
09/20/2011
Publication #:
Pub Dt:
03/21/2013
Title:
ARRANGEMENT OF THROUGH-SUBSTRATE VIAS FOR STRESS RELIEF AND IMPROVED DENSITY
Assignors
1
Exec Dt:
11/17/2011
2
Exec Dt:
11/17/2011
3
Exec Dt:
11/17/2011
Assignee
1
NO. 8, LI-HSIN ROAD 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
WON JOON KOUH-DUANE MORRIS LLP
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

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