Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 008589/0808 | |
| Pages: | 2 |
| | Recorded: | 05/29/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/27/1999
|
Application #:
|
08864969
|
Filing Dt:
|
05/29/1997
|
Title:
|
CHIP COMPOSITE ELECTRONIC COMPONENT WITH IMPROVED MOISTURE RESISTANCE AND METHOD OF MANUFACTURING THE SAME
|
|
Assignee
|
|
|
21, SAIIN MIZOSAKI-CHO, UKYO-KU |
KYOTO-SHI, JAPAN |
|
Correspondence name and address
|
|
NIKAIDO, MARMELSTEIN, ET.AL.
|
|
DAVID T. NIKAIDO
|
|
METRO. SQUARE, 655 15TH ST., N.W.
|
|
SUITE 330, G STREET LOBBY
|
|
WASHINGTON, D.C. 20005-5701
|
Search Results as of:
06/23/2024 04:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|