Patent Assignment Details
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Reel/Frame: | 043006/0808 | |
| Pages: | 7 |
| | Recorded: | 06/26/2017 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME INSIDE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 030761 FRAME: 0350. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11906840
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Filing Dt:
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10/04/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Assignee
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21, R&D FIRST ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU ROC, TAIWAN |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DR
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SAN DIEGO, CA 92121-1714
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