skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:029993/0810   Pages: 8
Recorded: 03/14/2013
Attorney Dkt #:P51106US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/16/2015
Application #:
13803108
Filing Dt:
03/14/2013
Publication #:
Pub Dt:
09/18/2014
Title:
CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignors
1
Exec Dt:
03/05/2013
2
Exec Dt:
03/05/2013
3
Exec Dt:
03/11/2013
4
Exec Dt:
03/13/2013
5
Exec Dt:
03/13/2013
6
Exec Dt:
03/13/2013
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
VIERING, JENTSCHURA & PARTNER - INF
3770 HIGHLAND AVE.
SUITE 203
MANHATTAN BEACH, CA 90266

Search Results as of: 09/23/2024 02:47 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT