Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 020193/0811 | |
| Pages: | 3 |
| | Recorded: | 11/21/2007 | | |
Attorney Dkt #: | 9862-000272/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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11984762
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Filing Dt:
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11/21/2007
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Publication #:
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Pub Dt:
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05/22/2008
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Title:
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LEAD FRAME UNIT, SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME UNIT, STACKED SEMICONDUCTOR PACKAGE HAVING A SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
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Assignee
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416, MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS DICKEY & PIERCE, PLC
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P.O. BOX 8910
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RESTON, VA 20195
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