Patent Assignment Details
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Reel/Frame: | 007904/0812 | |
| Pages: | 2 |
| | Recorded: | 03/11/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/1997
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Application #:
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08613023
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Filing Dt:
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03/11/1996
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Title:
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APPARATUS AND METHOD FOR ULTRASONIC BONDING LEAD FRAMES AND BONDING WIRES IN SEMICONDUCTOR PACKAGING APPLICATIONS
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA |
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Correspondence name and address
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HICKMAN BEYER & WEAVER
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STEVE D. BEYER
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P.O. BOX 61059
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PALO ALTO, CA 94306
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