Patent Assignment Details
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Reel/Frame: | 021203/0812 | |
| Pages: | 2 |
| | Recorded: | 06/26/2008 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12215317
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Filing Dt:
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06/26/2008
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Publication #:
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Pub Dt:
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01/01/2009
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Title:
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Semiconductor device and wire bonding method
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Assignee
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2-51-1, INADAIRA |
MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM L. ANDROLLA
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QUINN EMANUEL URQUHART OLIVER & HEDGES
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LLP KODA/ANDROLLA
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865 SOUTH FIGUEROA STREET, 10TH FLOOR
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LOS ANGELES, CA 90017
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