Patent Assignment Details
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Reel/Frame: | 029881/0812 | |
| Pages: | 2 |
| | Recorded: | 02/26/2013 | | |
Attorney Dkt #: | 2515.0398 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2018
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Application #:
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13771825
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Filing Dt:
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02/20/2013
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application Processor and Memory Integration
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS & ASSOCIATES
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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06/21/2024 03:41 AM
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