Patent Assignment Details
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Reel/Frame: | 016635/0814 | |
| Pages: | 4 |
| | Recorded: | 08/12/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/01/2008
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Application #:
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11127782
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Filing Dt:
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05/12/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Title:
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SEMICONDUCTOR CHIP WITH METALLIZATION LEVELS, AND A METHOD FOR FORMATION OF INTERCONNECT STRUCTURES
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Assignee
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ST. MARTIN STR. 53 |
MUNICH, GERMANY 81669 |
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Correspondence name and address
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IRA S. MATSIL
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SLATER & MATSIL, L.L.P.
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17950 PRESTON RD.
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SUITE 1000
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DALLAS, TEXAS 75252-5793
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