Patent Assignment Details
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Reel/Frame: | 009133/0817 | |
| Pages: | 3 |
| | Recorded: | 04/24/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2000
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Application #:
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09066044
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Filing Dt:
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04/24/1998
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Title:
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ENDPOINT DETECTOR AND METHOD FOR MEASURING A CHANGE IN WAFER THICKNESS IN CHEMICAL-MECHANICAL POLISHING OF SEMICONDUCTOR WAFERS AND OTHER MICROELECTRONIC SUBSTRATES
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Assignee
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P.O. BOX 6 |
8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83707 |
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Correspondence name and address
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SEED AND BERRY LLP
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PAUL T. PARKER
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6300 COLUMBIA CENTER
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701 FIFTH AVENUE
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SEATTLE, WA 98104-7092
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