Patent Assignment Details
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Reel/Frame: | 056730/0818 | |
| Pages: | 4 |
| | Recorded: | 07/01/2021 | | |
Attorney Dkt #: | 078697.00390 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16795095
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Filing Dt:
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02/19/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Title:
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Wafer Exposure Method Using Wafer Models and Wafer Fabrication Assembly
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Assignee
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DR.-KUELZ-RING 15 |
DRESDEN, GERMANY 01067 |
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Correspondence name and address
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HODGSON RUSS LLP
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140 PEARL STREET
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SUITE 100
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BUFFALO, NY 14202-4040
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09/24/2024 01:06 PM
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