Patent Assignment Details
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Reel/Frame: | 059976/0823 | |
| Pages: | 11 |
| | Recorded: | 05/20/2022 | | |
Attorney Dkt #: | AOS-P146D1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17750118
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Filing Dt:
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05/20/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
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Assignee
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100 KING STREET WEST, SUITE # 6000 |
TORONTO, CANADA ONTARIO M5X 1E2 |
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Correspondence name and address
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CHEN-CHI LIN
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1119 QUAIL CREEK CIRCLE
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SAN JOSE, CA 95120
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09/25/2024 06:06 AM
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