Patent Assignment Details
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| Reel/Frame: | 018642/0825 | |
| Pages: | 3 |
| | Recorded: | 12/13/2006 | | |
| Attorney Dkt #: | JCLA21993 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11610309
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Filing Dt:
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12/13/2006
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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CORELESS THIN SUBSTRATE WITH EMBEDDED CIRCUITS IN DIELECTRIC LAYERS AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 26, CHIN 3RD, 811, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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J.C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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