Patent Assignment Details
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| Reel/Frame: | 027443/0826 | |
| Pages: | 2 |
| | Recorded: | 12/24/2011 | | |
| Attorney Dkt #: | BDG091 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/15/2013
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Application #:
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13337054
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Filing Dt:
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12/24/2011
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Publication #:
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Pub Dt:
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04/19/2012
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE/LEDGE HEAT SPREADER, DUAL ADHESIVES AND CAVITY IN BUMP
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Assignee
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| 3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
| TAIPEI, TAIWAN |
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Correspondence name and address
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DAVID M. SIGMOND
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10 ANSON ROAD #47-14
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SINGAPORE, 079903 SINGAPORE
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