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Reel/Frame:040740/0826   Pages: 3
Recorded: 12/21/2016
Attorney Dkt #:102351-0857
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/26/2019
Application #:
15382594
Filing Dt:
12/16/2016
Publication #:
Pub Dt:
06/21/2018
Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS FOR MANUFACTURING THE SAME
Assignor
1
Exec Dt:
12/13/2016
Assignee
1
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondence name and address
FOLEY & LARDNER LLP
3000 K STREET, N.W.
SUITE 600
WASHINGTON, DC 20007

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