Patent Assignment Details
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Reel/Frame: | 019342/0827 | |
| Pages: | 3 |
| | Recorded: | 05/08/2007 | | |
Attorney Dkt #: | LEET.0025 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11797874
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Filing Dt:
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05/08/2007
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Publication #:
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Pub Dt:
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11/15/2007
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Title:
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Method of soldering component to substrate and electronic device made by the same
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Assignee
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6, FENG-SHU TSUEN, GUEISHAN |
TAOYUAN 333, TAIWAN R.O.C. |
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Correspondence name and address
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STANLEY P. FISHER
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REED SMITH LLP
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3110 FAIRVIEW PARK DR.
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SUITE 1400
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FALLS CHURCH, VA 22042
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