Total properties:
49
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|
Patent #:
|
|
Issue Dt:
|
03/24/1992
|
Application #:
|
07635087
|
Filing Dt:
|
12/28/1990
|
Title:
|
THERMOPLASTIC FILM, REINFORCED HOLLOW GLASS MICROSPHERE REINFORCED LAMINATES FOR THIN LOW DIELECTRIC CONSTANT SUBSTRATES
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|
|
Patent #:
|
|
Issue Dt:
|
11/16/1993
|
Application #:
|
07677229
|
Filing Dt:
|
03/29/1991
|
Title:
|
HIGH PERFORMANCE CURABLE PPO/MONOMERIC EPOXY COMPOSITIONS WITH TIN METAL SALT COMPATIBILIZING AGENT
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|
|
Patent #:
|
|
Issue Dt:
|
11/03/1992
|
Application #:
|
07685337
|
Filing Dt:
|
04/15/1991
|
Title:
|
SYSTEM AND METHOD FOR MANUFACTURING COPPER CLAD GLASS EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/27/1994
|
Application #:
|
07982797
|
Filing Dt:
|
11/30/1992
|
Title:
|
SYSTEM OF ELECTRONIC LAMINATES WITH IMPROVED REGISTRATION PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/1994
|
Application #:
|
07993147
|
Filing Dt:
|
12/18/1992
|
Title:
|
POLYIMIDE RESIN LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/08/1994
|
Application #:
|
08110437
|
Filing Dt:
|
08/23/1993
|
Title:
|
MULTIPLE LAYER PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURE
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|
|
Patent #:
|
|
Issue Dt:
|
04/30/1996
|
Application #:
|
08126478
|
Filing Dt:
|
09/24/1993
|
Title:
|
COPPER FOIL LAMINATE FOR PROTECTING MULTILAYER ARTICLES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/1995
|
Application #:
|
08143849
|
Filing Dt:
|
10/26/1993
|
Title:
|
COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/1995
|
Application #:
|
08153401
|
Filing Dt:
|
11/16/1993
|
Title:
|
SUBSTITUTED CYANOGUANIDINES AS CURING AGENTS FOR EPOXY RESINS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/1995
|
Application #:
|
08239072
|
Filing Dt:
|
05/06/1994
|
Title:
|
PROCESS FOR MEASUREMENT OF THE DEGREE OF CURE AND PERCENT RESIN OF GLASS-FIBER-REINFORCED EPOXY RESIN PREPREG
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/1995
|
Application #:
|
08246054
|
Filing Dt:
|
05/19/1994
|
Title:
|
SYSTEM OF ELECTRONIC LAMINATES WITH IMPROVED REGISTRATION PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/1996
|
Application #:
|
08297792
|
Filing Dt:
|
08/30/1994
|
Title:
|
METHOD OF MAKING A CIRCUIT BOARD OR LAYER THEREOF INCLUDING SEMI-CURING A SECOND ADHESIVE COATED ON A CURED FIRST ADHESIVE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/1996
|
Application #:
|
08340962
|
Filing Dt:
|
11/17/1994
|
Title:
|
CURING EPOXY RESINS USING DICY, IMIDAZOLE AND ACID
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/1998
|
Application #:
|
08422510
|
Filing Dt:
|
04/13/1995
|
Title:
|
METHOD OF MANUFACTURING LAMINATES AND PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/1997
|
Application #:
|
08442119
|
Filing Dt:
|
05/16/1995
|
Title:
|
CIRCUIT BOARD PREPREG WITH REDUCED DIELECTRIC CONSTANT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/1996
|
Application #:
|
08500540
|
Filing Dt:
|
07/11/1995
|
Title:
|
COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2009
|
Application #:
|
08540429
|
Filing Dt:
|
10/10/1995
|
Title:
|
REDUCING DUSTING OF EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/1997
|
Application #:
|
08562312
|
Filing Dt:
|
11/22/1995
|
Title:
|
ROLLER POSITION CONTROLLER FOR A CONTINUOUS BELT PRESS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/1997
|
Application #:
|
08570260
|
Filing Dt:
|
12/11/1995
|
Title:
|
SOLDER MASK FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2001
|
Application #:
|
08620525
|
Filing Dt:
|
03/22/1996
|
Title:
|
FILLERS FOR IMPROVED EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2001
|
Application #:
|
09024997
|
Filing Dt:
|
02/17/1998
|
Title:
|
POSITIVE ACTING PHOTODIELECTRIC COMPOSITION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2001
|
Application #:
|
09054264
|
Filing Dt:
|
04/03/1998
|
Title:
|
FABRICATION OF HIGH DENSITY MULTILAYER INTERCONNECT PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2001
|
Application #:
|
09123952
|
Filing Dt:
|
07/28/1998
|
Title:
|
HIGH DENSITY PRINTED CIRCUIT SUBSTRATE AND METHOD OF FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2000
|
Application #:
|
09224991
|
Filing Dt:
|
01/04/1999
|
Title:
|
METHODS OF MANUFACTURING VOIDLESS RESIN IMPREGNATED WEBS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2003
|
Application #:
|
09269014
|
Filing Dt:
|
06/14/1999
|
Publication #:
|
|
Pub Dt:
|
06/27/2002
| | | | |
Title:
|
EPOXY RESINS, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND CO-CROSSLINKING AGENT
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09270303
|
Filing Dt:
|
03/15/1999
|
Title:
|
COMPENSATION MODEL AND REGISTRATION SIMULATION APPARATUS AND METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
09276370
|
Filing Dt:
|
03/25/1999
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
PARALLEL PLATE BURIED CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
07/01/2003
|
Application #:
|
09666431
|
Filing Dt:
|
09/21/2000
|
Title:
|
SURFACE ENHANCED METAL PRESS PLATES FOR USE IN MANUFACTURE OF LAMINATES AND MULTILAYER MATERIALS AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2003
|
Application #:
|
09671386
|
Filing Dt:
|
09/27/2000
|
Title:
|
METHOD OF BULK FABRICATING PRINTED WIRING BOARD LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2001
|
Application #:
|
09735984
|
Filing Dt:
|
12/13/2000
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
TALC PARTICLES AS FILLERS FOR IMPROVED EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09760125
|
Filing Dt:
|
01/16/2001
|
Publication #:
|
|
Pub Dt:
|
08/23/2001
| | | | |
Title:
|
CYANATE ESTER BASED THERMOSET COMPOSITIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
10035975
|
Filing Dt:
|
11/09/2001
|
Publication #:
|
|
Pub Dt:
|
05/15/2003
| | | | |
Title:
|
MANUFACTURE OF PREPREGS AND LAMINATES WITH RELATIVELY LOW DIELECTRIC CONSTANT FOR PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2005
|
Application #:
|
10044628
|
Filing Dt:
|
01/10/2002
|
Publication #:
|
|
Pub Dt:
|
07/10/2003
| | | | |
Title:
|
PRODUCTION OF LAMINATES FOR PRINTED WIRING BOARDS USING PROTECTIVE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2006
|
Application #:
|
10309720
|
Filing Dt:
|
12/04/2002
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
Title:
|
THERMOSETTING RESIN COMPOSITION FOR HIGH PERFORMANCE LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/27/2004
|
Application #:
|
10316665
|
Filing Dt:
|
12/11/2002
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
LASER CUTTING OF LAMINATES FOR ELECTRICAL INSULATION TESTING
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2007
|
Application #:
|
10385044
|
Filing Dt:
|
03/10/2003
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
LAMINATE COMPOSITION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2012
|
Application #:
|
10858344
|
Filing Dt:
|
06/01/2004
|
Publication #:
|
|
Pub Dt:
|
12/01/2005
| | | | |
Title:
|
LAMINATE COMPOSITION FOR PRODUCING REDUCED CURL FLAT THIN CORE LAMINATE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2010
|
Application #:
|
10952033
|
Filing Dt:
|
09/28/2004
|
Publication #:
|
|
Pub Dt:
|
03/30/2006
| | | | |
Title:
|
FLAME RETARDANT COMPOSITIONS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10952102
|
Filing Dt:
|
09/28/2004
|
Publication #:
|
|
Pub Dt:
|
04/06/2006
| | | | |
Title:
|
Low expansion dielectric compositions
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2008
|
Application #:
|
11132846
|
Filing Dt:
|
05/19/2005
|
Publication #:
|
|
Pub Dt:
|
09/29/2005
| | | | |
Title:
|
THERMOSETTING RESIN COMPOSITION FOR HIGH PERFORMANCE LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2009
|
Application #:
|
11185259
|
Filing Dt:
|
07/20/2005
|
Publication #:
|
|
Pub Dt:
|
11/10/2005
| | | | |
Title:
|
EPOXY RESIN, SMA COPOLYMER AND BIS-MALEIMIDETRIAZINE RESIN
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2012
|
Application #:
|
11269132
|
Filing Dt:
|
11/08/2005
|
Publication #:
|
|
Pub Dt:
|
05/18/2006
| | | | |
Title:
|
FLAME RETARDANT COMPOSITIONS WITH A PHOSPHORATED COMPOUND
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11634471
|
Filing Dt:
|
12/06/2006
|
Publication #:
|
|
Pub Dt:
|
08/02/2007
| | | | |
Title:
|
Laminates for high speed and high frequency printed circuit boards
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2011
|
Application #:
|
11637222
|
Filing Dt:
|
12/11/2006
|
Publication #:
|
|
Pub Dt:
|
11/29/2007
| | | | |
Title:
|
EPOXY RESIN, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND CROSSLINKING AGENT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2011
|
Application #:
|
12139981
|
Filing Dt:
|
06/16/2008
|
Publication #:
|
|
Pub Dt:
|
10/16/2008
| | | | |
Title:
|
LAMINATE MADE FROM EPOXY RESIN, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND CROSSLINKERS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2011
|
Application #:
|
12398762
|
Filing Dt:
|
03/05/2009
|
Publication #:
|
|
Pub Dt:
|
01/14/2010
| | | | |
Title:
|
REDUCING DUSTING OF EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
12417463
|
Filing Dt:
|
04/02/2009
|
Publication #:
|
|
Pub Dt:
|
01/14/2010
| | | | |
Title:
|
PREPREG AND LAMINATE OF EPOXY RESIN, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND BIS-MALEIMIDETRIAZINE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12610004
|
Filing Dt:
|
10/30/2009
|
Publication #:
|
|
Pub Dt:
|
05/06/2010
| | | | |
Title:
|
FLAME RETARDANT COMPOSITIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
12773480
|
Filing Dt:
|
05/04/2010
|
Publication #:
|
|
Pub Dt:
|
05/12/2011
| | | | |
Title:
|
THERMOSETTING RESIN COMPOSITION FOR HIGH PERFORMANCE LAMINATES
|
|