Total properties:
18
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2001
|
Application #:
|
09353428
|
Filing Dt:
|
07/15/1999
|
Title:
|
INTER-CIRCUIT ENCAPSULATED PACKAGING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2002
|
Application #:
|
09432878
|
Filing Dt:
|
11/02/1999
|
Title:
|
INTER-CIRCUIT ENCAPSULATED PACKAGING FOR POWER DELIVERY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09785892
|
Filing Dt:
|
02/16/2001
|
Publication #:
|
|
Pub Dt:
|
10/25/2001
| | | | |
Title:
|
APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
09801437
|
Filing Dt:
|
03/08/2001
|
Publication #:
|
|
Pub Dt:
|
11/01/2001
| | | | |
Title:
|
METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09802329
|
Filing Dt:
|
03/08/2001
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
Title:
|
METHOD AND APPARATUS FOR THERMAL AND MECHANICAL MANAGEMENT OF A POWER REGULATOR MODULE AND MICROPROCESSOR IN CONTACT WITH A THERMALLY CONDUCTING PLATE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2003
|
Application #:
|
09921152
|
Filing Dt:
|
08/02/2001
|
Publication #:
|
|
Pub Dt:
|
02/07/2002
| | | | |
Title:
|
HIGH SPEED AND DENSITY CIRCULAR CONNECTOR FOR BOARD-TO-BOARD INTERCONNECTION SYSTEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09921153
|
Filing Dt:
|
08/02/2001
|
Publication #:
|
|
Pub Dt:
|
02/21/2002
| | | | |
Title:
|
VAPOR CHAMBER WITH INTEGRATED PIN ARRAY
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2004
|
Application #:
|
10005024
|
Filing Dt:
|
12/04/2001
|
Publication #:
|
|
Pub Dt:
|
11/07/2002
| | | | |
Title:
|
INTEGRATED POWER DELIVERY WITH FLEX CIRCUIT INTERCONNECTION FOR HIGH DENSITY HIGH POWER CIRCUITS FOR INTEGRATED CIRCUITS AND SYSTEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2003
|
Application #:
|
10022454
|
Filing Dt:
|
10/30/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
ULTRA-LOW IMPEDANCE POWER INTERCONNECTION SYSTEM FOR ELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/25/2005
|
Application #:
|
10036957
|
Filing Dt:
|
12/20/2001
|
Publication #:
|
|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
ULTRA-LOW IMPEDANCE POWER INTERCONNECTION SYSTEM FOR ELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2003
|
Application #:
|
10132586
|
Filing Dt:
|
04/25/2002
|
Publication #:
|
|
Pub Dt:
|
11/28/2002
| | | | |
Title:
|
SEPARABLE POWER DELIVERY CONNECTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2005
|
Application #:
|
10147138
|
Filing Dt:
|
05/16/2002
|
Publication #:
|
|
Pub Dt:
|
11/21/2002
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2004
|
Application #:
|
10150730
|
Filing Dt:
|
05/17/2002
|
Publication #:
|
|
Pub Dt:
|
11/28/2002
| | | | |
Title:
|
VORTEX HEATSINK FOR HIGH PERFORMANCE THERMAL APPLICATIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2007
|
Application #:
|
10201384
|
Filing Dt:
|
07/23/2002
|
Publication #:
|
|
Pub Dt:
|
12/26/2002
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
06/22/2004
|
Application #:
|
10245908
|
Filing Dt:
|
09/17/2002
|
Publication #:
|
|
Pub Dt:
|
03/20/2003
| | | | |
Title:
|
INTEGRATED MAGNETIC BUCK CONVERTER WITH MAGNETICALLY COUPLED SYNCHRONOUSLY RECTIFIED MOSFET GATE DRIVE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2004
|
Application #:
|
10290722
|
Filing Dt:
|
11/08/2002
|
Publication #:
|
|
Pub Dt:
|
03/27/2003
| | | | |
Title:
|
INTEGRATED POWER DELIVERY AND COOLING SYSTEM FOR HIGH POWER MICROPROCESSORS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2005
|
Application #:
|
10384057
|
Filing Dt:
|
03/04/2003
|
Publication #:
|
|
Pub Dt:
|
09/25/2003
| | | | |
Title:
|
RIGHT-ANGLE POWER INTERCONNECT ELECTRONIC PACKAGING ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2007
|
Application #:
|
10428202
|
Filing Dt:
|
04/30/2003
|
Publication #:
|
|
Pub Dt:
|
10/02/2003
| | | | |
Title:
|
MICRO-SPRING INTERCONNECT SYSTEMS FOR LOW IMPEDANCE HIGH POWER APPLICATIONS
|
|