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Patent Assignment Details
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Reel/Frame:062373/0828   Pages: 3
Recorded: 01/13/2023
Attorney Dkt #:170964-00061
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17664408
Filing Dt:
05/21/2022
Publication #:
Pub Dt:
12/01/2022
Title:
ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BARRIERS TO SOLID STATE SOLDER DIFFUSION AND METHODS OF FORMING THE SAME
Assignor
1
Exec Dt:
05/05/2022
Assignee
1
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
STANEK LEMON
982 TRINITY ROAD
RALEIGH, NC 27607

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