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Reel/Frame:036025/0829   Pages: 4
Recorded: 07/08/2015
Attorney Dkt #:35008-00001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/11/2016
Application #:
14794185
Filing Dt:
07/08/2015
Title:
METHOD FOR MANUFACTURING WAFER-LEVEL FAN-OUT PACKAGE
Assignors
1
Exec Dt:
06/22/2015
2
Exec Dt:
06/22/2015
3
Exec Dt:
06/22/2015
4
Exec Dt:
06/22/2015
5
Exec Dt:
06/22/2015
Assignee
1
16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU, CHEONAN-SI
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 330-220
Correspondence name and address
NOVAKD DRUCE CONNOLLY BOVE + QUIGG LLP
1875 I STREET, N.W.
ELEVENTH FLOOR
WASHINGTON, DC 20006

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