Patent Assignment Details
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| Reel/Frame: | 025576/0830 | |
| Pages: | 3 |
| | Recorded: | 01/04/2011 | | |
| Attorney Dkt #: | FORM/0019 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12981777
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Filing Dt:
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12/30/2010
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Publication #:
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Pub Dt:
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07/05/2012
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Title:
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TESTKEY STRUCTURE, CHIP PACKAGING STRUCTURE, AND METHOD FOR FABRICATING THE SAME
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Assignee
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| 2F, NO. 23, LI-HSIN RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU 300, TAIWAN |
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Correspondence name and address
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PATTERSON & SHERIDAN, LLP
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595 SHREWSBURY AVENUE
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SUITE 100
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SHREWSBURY, NJ 07702
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