Patent Assignment Details
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| Reel/Frame: | 034363/0830 | |
| Pages: | 5 |
| | Recorded: | 12/03/2014 | | |
| Attorney Dkt #: | JP920110023US3 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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14559656
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Filing Dt:
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12/03/2014
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Publication #:
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Pub Dt:
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03/26/2015
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Title:
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FORMATION OF THROUGH-SILICON VIA (TSV) IN SILICON SUBSTRATE
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Assignee
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| INTERNATIONAL BUSINESS MACHINES CORPORATION |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION IP LAW DEPARTMENT
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294 ROUTE 100
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P.O. BOX 100
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SOMERS, NY 10589
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