Patent Assignment Details
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Reel/Frame: | 038132/0832 | |
| Pages: | 6 |
| | Recorded: | 03/30/2016 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/25/2018
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Application #:
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14735229
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Filing Dt:
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06/10/2015
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Publication #:
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Pub Dt:
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12/15/2016
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Title:
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LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
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Assignee
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150 MOTOR PARKWAY |
HAUPPAUGE, NEW YORK 11788 |
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Correspondence name and address
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MAYER & WILLIAMS PC
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928 MOUNTAIN AVENUE
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MOUNTAINSIDE, NJ 07092
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05/29/2024 09:49 AM
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