Patent Assignment Details
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Reel/Frame: | 052418/0833 | |
| Pages: | 12 |
| | Recorded: | 04/16/2020 | | |
Attorney Dkt #: | PA3997-0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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16850591
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Filing Dt:
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04/16/2020
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Publication #:
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Pub Dt:
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02/25/2021
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Title:
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METHOD OF PLANARIZING INSULATING LAYER FOR MEMORY DEVICE
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Assignee
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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WILLIAM PARK & ASSOCIATES LTD.
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930 N. YORK ROAD, SUITE 201
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HINSDALE, IL 60521
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09/22/2024 05:08 PM
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