Patent Assignment Details
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| Reel/Frame: | 013063/0834 | |
| Pages: | 11 |
| | Recorded: | 06/26/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10180225
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Filing Dt:
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06/26/2002
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Publication #:
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Pub Dt:
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01/02/2003
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Title:
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Method for achieving copper fill of high aspect ratio interconnect features
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Assignee
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| P.O. BOX 450-A |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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APPLIED MATERIALS, INC.
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MIREILLE C. PERRET
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P.O. BOX 450-A
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PATENT COUNSEL
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SANTA CLARA, CA 95052
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