Patent Assignment Details
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| Reel/Frame: | 023477/0835 | |
| Pages: | 3 |
| | Recorded: | 11/05/2009 | | |
| Attorney Dkt #: | CS2009/036 (1016-155) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12613224
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Filing Dt:
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11/05/2009
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Publication #:
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Pub Dt:
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05/05/2011
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORE REGION AND BOND PAD AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET 2 |
| SINGAPORE 738406, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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