Patent Assignment Details
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Reel/Frame: | 055273/0837 | |
| Pages: | 3 |
| | Recorded: | 02/16/2021 | | |
Attorney Dkt #: | 19-TPY0600US02/810163.629 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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17104968
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Filing Dt:
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11/25/2020
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Publication #:
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Pub Dt:
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07/01/2021
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Title:
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WLCSP PACKAGE WITH DIFFERENT SOLDER VOLUMES
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Assignee
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28 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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ZACHARY SAKOI, SEED IP LAW GROUP LLP
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701 5TH AVE
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SUITE 5400
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SEATTLE, WA 98104
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09/22/2024 07:37 PM
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