Patent Assignment Details
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Reel/Frame: | 015350/0838 | |
| Pages: | 4 |
| | Recorded: | 11/10/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10931654
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Filing Dt:
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08/31/2004
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Title:
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MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
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Assignee
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5 YISHUN ST. 23 |
SINGAPORE 768442, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD., STE. A1
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SUNNYVALE, CA 94087
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