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Total properties:
18
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Patent #:
|
|
Issue Dt:
|
10/06/1992
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Application #:
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07658397
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Filing Dt:
|
02/20/1991
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Title:
|
DIGITALLY CONTROLLED METHOD AND APPARATUS FOR DELIVELING TONERS TO SUBSTRATES
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|
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Patent #:
|
|
Issue Dt:
|
10/30/2001
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Application #:
|
09239604
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Filing Dt:
|
01/29/1999
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Title:
|
PRINTING APPARATUS AND METHOD FOR IMAGING CHARGED TONER PARTICLES USING DIRECT WRITING METHODS
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|
|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
10237524
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Filing Dt:
|
09/06/2002
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|
Publication #:
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|
Pub Dt:
|
03/13/2003
| | | | |
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Title:
|
Computing device with roll up components
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|
|
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Patent #:
|
|
Issue Dt:
|
03/17/2009
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Application #:
|
10448611
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Filing Dt:
|
05/29/2003
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Publication #:
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Pub Dt:
|
09/09/2004
| | | | |
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Title:
|
APPARATUS AND METHOD FOR TESTING ELECTRONIC SYSTEMS
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|
|
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Patent #:
|
|
Issue Dt:
|
08/19/2008
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Application #:
|
10666896
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Filing Dt:
|
09/17/2003
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|
Publication #:
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Pub Dt:
|
04/08/2004
| | | | |
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Title:
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APPARATUS AND METHOD FOR DEPLOYING AN INFORMATION RETRIEVAL SYSTEM
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|
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Patent #:
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NONE
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Issue Dt:
|
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Application #:
|
10783163
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Filing Dt:
|
02/19/2004
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|
Publication #:
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|
Pub Dt:
|
08/25/2005
| | | | |
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Title:
|
System in package
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|
|
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Patent #:
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|
Issue Dt:
|
08/05/2008
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Application #:
|
10783662
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Filing Dt:
|
02/20/2004
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Publication #:
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Pub Dt:
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02/24/2005
| | | | |
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Title:
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INTERCONNECTION CIRCUIT AND ELECTRONIC MODULE UTILIZING SAME
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|
|
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Patent #:
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Issue Dt:
|
01/16/2007
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Application #:
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11007720
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Filing Dt:
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12/07/2004
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Publication #:
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Pub Dt:
|
04/13/2006
| | | | |
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Title:
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METHOD FOR TEMPORARILY ENGAGING ELECTRONIC COMPONENT FOR TEST
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|
|
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Patent #:
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|
Issue Dt:
|
09/23/2008
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Application #:
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11015213
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Filing Dt:
|
12/16/2004
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|
Publication #:
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Pub Dt:
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06/22/2006
| | | | |
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Title:
|
REPAIRABLE THREE-DIMENSIONAL SEMICONDUCTOR SUBSYSTEM
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|
|
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Patent #:
|
|
Issue Dt:
|
08/07/2007
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Application #:
|
11101934
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Filing Dt:
|
04/08/2005
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|
Publication #:
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Pub Dt:
|
11/17/2005
| | | | |
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Title:
|
COOLING APPARATUS AND METHOD
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|
|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11101935
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Filing Dt:
|
04/08/2005
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|
Publication #:
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|
Pub Dt:
|
11/17/2005
| | | | |
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Title:
|
Micro blade assembly
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|
|
|
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Patent #:
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|
Issue Dt:
|
05/19/2009
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Application #:
|
11249909
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Filing Dt:
|
10/12/2005
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|
Publication #:
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Pub Dt:
|
05/18/2006
| | | | |
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Title:
|
TILED CONSTRUCTION OF LAYERED MATERIALS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11454674
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Filing Dt:
|
06/16/2006
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|
Publication #:
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|
Pub Dt:
|
01/11/2007
| | | | |
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Title:
|
Semiconductor wafer tester
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11494810
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Filing Dt:
|
07/27/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
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Title:
|
Electro-optic interconnection apparatus and method
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11494811
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Filing Dt:
|
07/27/2006
|
|
Publication #:
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|
Pub Dt:
|
02/01/2007
| | | | |
|
Title:
|
Flip chip interface including a mixed array of heat bumps and signal bumps
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|
|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11495009
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Filing Dt:
|
07/27/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
|
Title:
|
COPPER SUBSTRATE WITH FEEDTHROUGHS AND INTERCONNECTION CIRCUITS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/08/2009
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Application #:
|
11495954
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Filing Dt:
|
07/27/2006
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|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
|
Title:
|
SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11502223
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Filing Dt:
|
08/09/2006
|
|
Publication #:
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|
Pub Dt:
|
02/14/2008
| | | | |
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Title:
|
Electronic printing press
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|
