Patent Assignment Details
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Reel/Frame: | 012621/0842 | |
| Pages: | 6 |
| | Recorded: | 02/28/2002 | | |
Conveyance: | CORRECTED RECORDATION FORM COVER SHEET TO CORRECT STATE OF INCORPORATION, PREVIOUSLY RECORDED AT REEL/FRAME 8942/0949 (ASSIGNMENT OF ASSIGNOR'S INTEREST) |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08998442
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Filing Dt:
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12/24/1997
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Title:
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APPLICATION OF WIRE BOND LOOP AS INTEGRATED CIRCUIT PACKAGE COMPONENT INTERCONNECT
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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BEYER & WEAVER, LLP
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STEVE D BEYER
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2900 SEMICONDUCTOR DRIVE
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SANTA CLARA, CA 95052
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