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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:024703/0842   Pages: 118
Recorded: 07/19/2010
Attorney Dkt #:ASSIGNMENT & NAME CHANGE
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 13
1
Patent #:
Issue Dt:
06/16/2015
Application #:
09955644
Filing Dt:
09/18/2001
Publication #:
Pub Dt:
06/20/2002
Title:
Non-reactive adhesive useful in transdermal drug delivery system
2
Patent #:
Issue Dt:
11/11/2003
Application #:
10052422
Filing Dt:
01/16/2002
Publication #:
Pub Dt:
08/28/2003
Title:
PROCESS FOR THE MANUFACTURE OF COPOLYMERS OF FORMALDEHYDE AND DIPHENYL OXIDE
3
Patent #:
Issue Dt:
04/25/2006
Application #:
10327353
Filing Dt:
12/20/2002
Publication #:
Pub Dt:
06/24/2004
Title:
EPOXY-FUNCTIONAL HYBRID COPOLYMERS
4
Patent #:
Issue Dt:
06/24/2008
Application #:
10556193
Filing Dt:
11/10/2005
Publication #:
Pub Dt:
02/08/2007
Title:
CURABLE LIQUID COMPOSITIONS CONTAINING BISOXAZOLINE
5
Patent #:
NONE
Issue Dt:
Application #:
10783080
Filing Dt:
02/20/2004
Publication #:
Pub Dt:
08/25/2005
Title:
Dissolvable film and method of manufacture
6
Patent #:
Issue Dt:
01/12/2010
Application #:
10810772
Filing Dt:
03/26/2004
Publication #:
Pub Dt:
09/29/2005
Title:
NOVEL REACTIVE HOT MELT ADHESIVES
7
Patent #:
NONE
Issue Dt:
Application #:
10816093
Filing Dt:
04/01/2004
Publication #:
Pub Dt:
10/06/2005
Title:
Method for reducing freeze-thaw voids in uncured adhesives
8
Patent #:
Issue Dt:
12/09/2008
Application #:
11393496
Filing Dt:
03/30/2006
Publication #:
Pub Dt:
02/22/2007
Title:
RADIATION-CURABLE DESICCANT-FILLED ADHESIVE/SEALANT
9
Patent #:
Issue Dt:
01/12/2016
Application #:
11603733
Filing Dt:
11/22/2006
Publication #:
Pub Dt:
08/21/2008
Title:
Novel material forming supramolecular structures, process and uses
10
Patent #:
Issue Dt:
09/09/2008
Application #:
11651719
Filing Dt:
01/10/2007
Publication #:
Pub Dt:
07/10/2008
Title:
HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING
11
Patent #:
Issue Dt:
05/27/2008
Application #:
11672647
Filing Dt:
02/08/2007
Title:
HOT MELT ADHESIVES
12
Patent #:
Issue Dt:
01/29/2013
Application #:
11732242
Filing Dt:
04/03/2007
Publication #:
Pub Dt:
10/09/2008
Title:
HOT MELT ADHESIVE
13
Patent #:
Issue Dt:
11/05/2013
Application #:
11962872
Filing Dt:
12/21/2007
Publication #:
Pub Dt:
06/25/2009
Title:
METHOD FOR PREPARING A MOISTURE CURABLE HOT MELT ADHESIVE
Assignor
1
Exec Dt:
04/01/2008
Assignee
1
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondence name and address
HENKEL CORPORATION
10 FINDERNE AVENUE
PATENT DEPARTMENT
BRIDGEWATER, NJ 08807

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