Patent Assignment Details
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Reel/Frame: | 056537/0842 | |
| Pages: | 6 |
| | Recorded: | 06/14/2021 | | |
Attorney Dkt #: | M2523.10493US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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07/02/2024
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Application #:
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17413560
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Filing Dt:
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06/13/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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SUBSTRATE BONDING APPARATUS
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Assignee
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2F, 15-23, DONGTANSANDAN 6-GIL |
HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 18487 |
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Correspondence name and address
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MASCHOFF BRENNAN
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1389 CENTER DRIVE, SUITE 300
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PARK CITY, UT 84098
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06/22/2024 03:22 PM
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