Patent Assignment Details
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Reel/Frame: | 061435/0844 | |
| Pages: | 5 |
| | Recorded: | 10/16/2022 | | |
Attorney Dkt #: | 220815-1115JD |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18046927
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Filing Dt:
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10/16/2022
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Publication #:
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Pub Dt:
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12/28/2023
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Title:
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Heat dissipation optimization method of silicon-based SU-8 thin film package
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Assignee
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NO.800 DONGCHUAN ROAD, MINHANG DISTRICT |
SHANGHAI, CHINA 200240 |
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Correspondence name and address
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YUNGPING CHIANG
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38444 MIDNIGHT SKY PLACE
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HAMILTON, VA 20158
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09/22/2024 07:56 AM
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