Patent Assignment Details
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Reel/Frame: | 039799/0845 | |
| Pages: | 4 |
| | Recorded: | 08/24/2016 | | |
Attorney Dkt #: | 70027-1640 |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12718939
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Filing Dt:
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03/05/2010
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Publication #:
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Pub Dt:
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09/08/2011
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4677 OLD IRONSIDES DRIVE
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SUITE 370
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SANTA CLARA, CA 95054
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