Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 041232/0845 | |
| Pages: | 14 |
| | Recorded: | 02/13/2017 | | |
| Attorney Dkt #: | IMB 18 US CON 2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2021
|
Application #:
|
15355096
|
Filing Dt:
|
11/18/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/09/2017
| | | | |
|
Title:
|
Circuit board structure and method for manufacturing a circuit board structure
|
|
|
Assignee
|
|
|
|
|
| KUORTANEENKATU 2 |
| HELSINKI, FINLAND 00510 |
|
|
Correspondence name and address
|
| |
SEPPO LAINE OY
|
| |
ITÄMERENKATU 3 A
|
| |
HELSINKI, 00180 FINLAND
|
Search Results as of:
06/27/2024 01:14 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
