Patent Assignment Details
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Reel/Frame: | 018308/0846 | |
| Pages: | 7 |
| | Recorded: | 09/27/2006 | | |
Attorney Dkt #: | C2010-700110 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11455226
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Title:
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Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
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Assignee
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12 JOO KOON ROAD |
SINGAPORE, SINGAPORE 628975 |
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Correspondence name and address
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KEITH F. NOE
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RIVERFRONT OFFICE PARK, ONE MAIN STREET
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LOWRIE, LANDO & ANASTASI, LLP
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CAMBRIDGE, MA 02142
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